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The ultrasonic wire bonding has been applied in the semiconductor packaging industry ever since its innovation in the 1960s. The mechanisms of the bonding process, however, are still unclear. According to state-of-the-art, the extremely short bonding process can be divided into four phases. These phases at the bonding interface were analyzed either from a side view or from a 2-D view but only after...
In cochlear implant (CI) patients, an increase in electrode impedance due to fibrotic encapsulation is frequently observed. Several attempts have been proposed to reduce fibroblast growth at the electrode contacts, but none proved to be satisfactory so far. Here, a silicone fiber coating of the electrode contacts is presented that provides a complex micro‐scale surface topography and increases hydrophobicity...
As an inevitable step during ultrasonic bonding of aluminum or copper materials, the removal of oxides that prevent the bond formation is essential for obtaining high quality. Nevertheless, the oxides removal process is still unclear after tens of years' application of ultrasonic bonding. In this project, the removal mechanism was investigated via the analysis of an artificially coated oxide layer...
Many groups of engineers and researchers worldwide are involved in the application-oriented development of sensors. These efforts are often triggered by industrial applications and their extraordinary requirements in durability and reliability. Typical products are highly specialized sensors e.g. for temperature which are exposed to high physical and chemical stresses like in cutting or forming processes...
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