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Space electronic products usually should meet the mission requirements of long life and low cost. Because of insufficient failure data, it is hard to assess the reliability precisely by using traditional reliability testing and statistical method. In this paper, a method of reliability assessment based on integration of highly accelerated life testing (HALT) and accelerated degradation testing (ADT)...
Power module with high power density and high heat dissipation structure has been developed because of increasing requirement for high-power electric products. Power cycling test (PCT) was often adopted to assess to reliability of power module while the cyclic load was applid in power chip. This study investigates the electro-thermo-mechanical behavior of high-power module by using numerical analysis,...
The drive for small form factor and foot print area packages is being fueled by consumer electronic applications that today constitute 50% of semiconductor revenue. Mobile phones are experiencing explosive growth both in terms of unit shipments and increased complexity at the same time. In just one decade mobile phone has transformed from a simple communication device into more complex system integrating...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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