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In this paper, the effect of reflow time on shear property of Sn-9Zn solder bumps was studied. The Sn-9Zn solder bumps were prepared by two step electroplating method. With the increase of reflow time, the shear strength decreased first and then increased. The change of shear strength was closely related to the formation of intermetallic compounds (IMCs). Scanning electron microscope (SEM) and Energy...
Dielectric charging/discharging in the real-life electrostatic microelectromechanical system device is proposed to be evaluated by the capacitance-voltage response for an analogous metal-insulator–semiconductor (MIS) structure. An analytical model based on this approach has been established. In the experiment, the relaxation behaviors of trapped charges in silicon nitride of MIS structure have been...
In this paper, the Sn-3.5Ag solder bumps were prepared successfully by two-step electroplating method. The effect of reflow time on shear property of solder bumps and Cu was investigated. After shear tests, the shear strength of Sn-3.5Ag solder bumps peaked at the reflow time of 60s, and then decreased with further increasing reflow time. It was considered that the variation of shear strength was...
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