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Editor’s note: The authors target the typical problem of a small number of test access ports. As a solution, they propose a set of interposers to obtain access to the tested nets. Jörg Henkel, Karlsruhe Institute of Technology
The Cu specimens were fabricated by the UV-LIGA process using the electrodeposition bath for through-silicon-via (TSV) filling. Mechanical property of th e Cu specimens was investigated by a uniaxial tensile test. The elastic modulus, yield strength, breaking stre ngth and ultimate strain are 95GPa, 314MPa, 367MPa and 12.4%, respectively. The results indicated that the yield strength and breaking...
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