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More than 750,000 females and 500,000 males in Taiwan will be diagnosed as osteoarthritis (OA) patient in 2018. Also, two thirds of orthopedics outpatients are found to be associated with OA. Therefore, it becomes necessary and essential to detect the severity of OA knee joints as early as possible and to release/reduce the knee pain induced by OA. In recent years, the wearable technology has become...
Failures like short circuit are always encountered in PCBs (printed circuit boards) due to defects in the flexible interconnection. In this paper, systematic analysis such as macro and micro observation was carried out on shorting trace in Polyimides (PI) films used for flexible substrates interconnection (FSI) packaging applications. The thin flexible PI films have desirable properties for use in...
A comprehensive integrated electro-thermo coupling model is developed to investigate the electro-thermo-mechanical effects and electromigration analysis on Package-on-Package (POP) in this paper. POP packaging involves in ultra thin gold wire (??=1mil) on wirebonding and Sn4.0Ag0.6Cu (SAC405) solder ball on package. The current density arising in the aluminum pad (wirebonding) and in the Copper trace...
The purpose of this research is to study the parametric factors of wire bonding and optimal design rules for 4-layer mini stack-die package. This paper demonstrates the characteristic of low loop height, fine bond pad pitch and long overhead staggered chip in mini SD package. The loop height is limited to 3.5mil, the diameter of gold wire is 0.8 mil and the bond pad pitch is 45mum. The collaborated...
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