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The mechanism of wirebonding bondability for ultra thin Copper wire is described in this research. Two major analyses are conducted in the present paper. In the first, the characteristic of heat affected zone (HAZ) and free air ball (FAB) on thin Copper (Cu) wire have been carefully experimental measured. Thin film interfacial micro-tribology behavior between Cu FAB and Al pad is examined by Atomic...
A comprehensive integrated electro-thermo coupling model is developed to investigate the electro-thermo-mechanical effects and electromigration analysis on Package-on-Package (POP) in this paper. POP packaging involves in ultra thin gold wire (??=1mil) on wirebonding and Sn4.0Ag0.6Cu (SAC405) solder ball on package. The current density arising in the aluminum pad (wirebonding) and in the Copper trace...
This paper demonstrates two major works, experimentally determines the material properties and accurately predicts the dynamic response of stressed region on the bond pad and beneath the contact area. The characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer...
In the present paper, the characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer during wire bonding process has been predicted by using finite element method. Material property for Cu wire from mechanical tensile test has shown much more rigid than Au wire...
In the present paper, the tensile mechanical properties of thin gold wire before/after electric flame-off process have been investigated by self-design pull test fixture. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also studied. The accurate experimental material data should be reflected as input for precise finite element analysis. Numerical model based...
The purpose of this research is to study the parametric factors of wire bonding and optimal design rules for 4-layer mini stack-die package. This paper demonstrates the characteristic of low loop height, fine bond pad pitch and long overhead staggered chip in mini SD package. The loop height is limited to 3.5mil, the diameter of gold wire is 0.8 mil and the bond pad pitch is 45mum. The collaborated...
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