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In this paper, the growth mechanism of intermetallic compound (IMC) layer between Copper (Cu) free air ball (FAB) and Aluminum (Al) bond pad is carefully examined. The test vehicle is pd-coated Cu wirebonds on Al pad in plastic ball grid array (PBGA) package. Palladium (Pd), the anti-oxide material coated on Cu wire will be blended in the Cu FAB when the ball is formed by an electrical flame-off (EFO)...
The aim of present research is to investigate the characteristic of ultra thin copper wire and aluminum pad. In the first, the electric flame-off (EFO) characteristic of ultra thin copper wire has been carefully examined. Experimental results show thermal aging effect has significantly influence on the micro structure of free air ball (FAB). Optical microscopic (OM) examination for an as-drawn copper...
Measured lateral wavelength distribution of LDA is presented, showing typically a V-type feature. Analyses indicate it is induced by bonding stress. A linear distributed stress model is proposed to explain the experimental results.
This paper demonstrates two major works, experimentally determines the material properties and accurately predicts the dynamic response of stressed region on the bond pad and beneath the contact area. The characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer...
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