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Creep test of C/SiC composite with and without protective layer under various stresses and temperatures in hot oxidizing atmosphere were conducted. Specimens with oxidation protective layer demonstrated much lower strain rate. Based on the equivalent steady state strain rates from these tests, phenomenological creep models were developed. Moreover, the micro-mechanism of creep of C/SiC material were...
In this paper, the pumping behaviors of copper filler from TSV were systematically investigated. First, in-situ observation of copper pumping from TSV was conducted in scanning electronic microscope (SEM), the pumping height of copper filler and its evolution with time and temperature was recorded, it is found that the pumping rate increase with temperature and the maximum pumping height reached 12...
In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder...
In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder...
In this paper, steady-state creep behavior of lead free 80Au-20Sn solder was investigated at three different temperatures (i.e. 25degC, 75degC and 125degC) and a range of stress levels. Hyperbolic-Sine model was employed to characterize the creep properties of the lead free solder, constants in the model were determined through data fitting and were compared with that of other lead free solders.
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