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As Integrated Circuits (ICs) become more complex through smaller semiconductor feature sizes and higher performance requirements, the thorough testing of silicon devices is becoming a greater economic challenge. System-on-Chip (SoC) test schedules not only need to achieve the shortest possible test application time, they must also satisfy new design constraints which are increasing test scheduling...
Increasing design complexity coupled with new design and manufacturing techniques being used for modern integrate circuits is creating challenges for test environment. The goal of system-on chip (SoC) test scheduling has always been to reduce test application time. Added design constraints for SoC environment are making this scheduling more difficult. This difficulty is increased by manufacturing...
As a consequence of technology scaling and increasing power consumption of modern high performance designs, various techniques, such as clock gating and Dynamic Voltage and Frequency Scaling (DVFS), have been adapted to address power issues. These techniques are important and desirable to address reliability needs as well as economic issues. From a testing point of view, the introduction of power...
Various techniques for modern high performance designs, such as clock gating and dynamic voltage frequency scaling (DVFS), have been adapted to address power issues. This is a consequence of technology scaling and it is important and desirable to address reliability needs as well as economic issues. From a testing point of view, introduction of power constraints during testing is needed for the desired...
With technology scaling towards smaller geometries, the power density of modern integrated circuits (ICs) can potentially result into high temperatures during test, a problem further compounded by stacking dies in 3D stacked structures (3DSICs). Scheduling tests in a way to minimize the total test time becomes a key issue when temperature constraints are involved, since a more compact schedule leads...
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