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Floating gate (FG) devices using barrier-engineered (BE) tunneling dielectric have been studied both theoretically and experimentally. Through WKB modeling the tunneling efficiency of various multi-layer tunneling barriers can be well predicted. Experimental results for FG devices with oxide-nitride-oxide (ONO) U-shaped barrier are examined to validate our model. Furthermore, a large-density array...
Barrier engineered charge-trapping NAND flash (BE-CTNF) devices are extensively examined by theoretical modeling and experimental validation. A general analytical tunneling current equation for multi-layer barrier is derived using WKB approximation. The rigorously derived analytical form is valid for both electron and hole tunneling, as well as for any barrier composition. With this, the time evolution...
BE-SONOS [1] is successfully integrated in a 0.13 mum NAND Flash technology. BE-SONOS device employs a bandgap engineered ONO barrier, which allows efficient hole tunneling erase and yet prevents the direct tunneling leakage during retention. BE-SONOS can overcome the fundamental limitation of the conventional SONOS, for which good data retention and fast erase speed cannot be simultaneously achieved...
A bandgap engineered SONOS with greatly improved reliability properties is proposed. This concept is demonstrated by a multilayer structure of O1/N1/O2/N2/O3, where the ultra-thin "O1/N1/O2" serves as a non-trapping tunneling dielectric, N2 the high-trapping-rate charge storage layer, and O3 the blocking oxide. The ultra-thin "O1/N1/O2" provides a "modulated tunneling barrier"...
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