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In this paper, we studied defect discovery and defect review using back-scattered electron (BSE) images. We found that some defects can only be effectively imaged with BSE mode such as hafnium oxide remain at metal gate chemical mechanical polishing (CMP) in the gate last high-k metal gate (HKMG) process. It can also enhance contrast for materials in the bottom of high aspect ratio (HAR) trenches...
The contents of some heavy metals (Cu, Zn, Pb, Cd and Cr) in dustfall samples from different city zones of Quanzhou were analyzed and their toxicity was assessed by toxicity characteristic leaching procedure (TCLP), which was developed by USEPA. The TCLP method is a currently recognized international method for evaluation of heavy metal pollution in dustfall. The available levels of Cu, Zn, Pb, Cd...
Copper (Cu) is a major heavy metal contaminant with various anthropogenic and natural sources. Recently, using biomarkers to monitor the effects of pollutants has attracted increased interest. Pot culture experiments using radish (Raphanus sativus L.) was performed to investigate Cu phytotoxic effects on antioxidant enzymes and other early warning biomarkers of soil Cu exposure. Under low dose Cu...
In this study, we investigated the root cause of the conducting bump defects detected by optical inspection system that had the same signature as sampling pattern of electron beam inspection (EBI) at tungsten (W) chemical mechanical polish (CMP) and at copper (Cu) CMP. We found that the bump defects were formed due to the combined effects of EBI and de-ionized (DI) water clean right after EBI. Model...
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