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An electron cooling junction using platinum silicide as a superconductor contact is demonstrated for the first time. The junction shows encouraging electrical characteristics and a fit to a standard cooling model predicts cooling from 100 mK to 50 mK for a test device. Silicides have been widely used in the semiconductor industry because of their reliability and reduced contact resistance; hence this...
We have investigated the transient thermal behavior and heat distribution in a multi-quantum wells (MQWs) InGaN/GaN lasers diode for λ~445 nm based on GaN substrate. 2D thermal modeling was performed to estimate the dissipation of heat from the active region. Different thermal designs for planner and solder ball bumps packages have been studied using Al2O3, ceramic-AlN and SiC as submount...
The demand for data center solutions with lower total cost of ownership and lower complexity of management is driving the creation of next generation datacenters. The information technology industry is in the midst of a transformation to lower the cost of operation through consolidation and better utilization of critical data center resources. Successful consolidation necessitates increasing utilization...
Next generation data centers must be designed to meet service level agreements (SLAs) for application performance while reducing costs and environmental impact. Traditional design approaches are manually intensive and must integrate thousands of components at multiple granularities, often with conflicting goals. We propose an automated data center synthesizer to design sustainable data centers that...
The growing energy consumption of computer data centers has recently received increased economic and environmental scrutiny. A significant portion of typical data center energy consumption can be apportioned to the cooling infrastructure. This paper shows the impact of heat load within the data center on the efficiency of the data center cooling ensemble, as measured in terms of a 'grand' Coefficient...
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