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A 1550nm external-cavity hybrid III-V/SOI laser with a room-temperature threshold current of 18mA and output powers up to 4mW was demonstrated with a novel assembly technique. An edge-coupled 1×6 laser array was passively aligned with sub-micron positional tolerance.
We report a compact laser on-chip module that is hybrid integrated with photonic circuits. Arrays of III-V MQW lasers were flip-chip bonded onto an SOI interposer along with micro-machined mirrors for optical coupling into a dedicated grating coupler array. This is a new wafer-scale opto-electronic integration platform enabling photonic links with built-in high efficiency light sources.
We present the design of a silicon microsystem that utilizes dense, low-power photonic interconnects to enable a highly-compact supercomputer-scale system. We review recent progress in wavelength-division multiplexed, low-power silicon photonic interconnect components and discuss a future roadmap for the technology.
We review the potential benefits and challenges for achieving optical-interconnects to the chip via the native integration of silicon photonics components with VLSI electronics; and review the "macrochip" a collection of contiguous silicon chips enabled by optical proximity communication. We summarize recent progress towards achieving low-power photonic links for the macrochip.
The talk will present the design of a silicon microsystem that utilizes photonic interconnects to enable a highly compact supercomputer-scale system. Recent progress in dense, wavelength-division multiplexed, low-power silicon photonic interconnect components will be reviewed.
Epitaxially grown Nd(0.5%):(Gd, Lu)2O3 and Er(0.6%):(Gd, Lu)2O3 waveguides deposited on Y2O3 by pulsed laser deposition, providing peak emission cross sections comparable with those of Lu2O3 bulk crystals, have been fabricated and structured. Rib waveguiding has been shown.
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