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Future ultra-scaled logic and low-power systems require fundamental advances in semiconductor device technology. Due to power constraints, device concepts capable of achieving switching slopes (SS) steeper than 60 mV/decade are essential if scaling of conventional computational architectures is to continue. Likewise, ultra low power systems also benefit from devices capable of maintaining performance...
Obtaining a uniform coating on curved mechanical parts such as gas turbine blades is one of the industrial challenges in suspension plasma spraying. Through a three dimensional numerical analysis, this study is aimed at providing a better understanding of the effect of substrate curvature on in-flight particle temperature, velocity, and trajectory. The high temperature and high velocity plasma flow...
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