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As the adoption of Cu bond wires continues, increasing quantity of component families are being qualified by component suppliers using standard acceleration test methods and durations. While these tests provide a benchmark comparison with conventional technologies such as Au wire bonding, for users of these components for high-reliability applications, a frequent discussion on reliability assessment...
Soft errors caused by different high energetic radiation particles, such as alpha, neutron, thermal neutron, proton, and heavy ions are well studied and understood. But few studies have been complete on effect of Radon on IC components soft error. Complicating matters, Radon a naturally occurring radioactive gas could diffuse into and through the different IC package materials and emit alpha particles...
The electromigration of flip chip solder joints is an ongoing reliability concern for manufacturers of integrated circuit (IC) components and electronic systems. As power levels of ICs continue to increase, current densities within individual solder bumps often increase, along with the operation temperatures of the die surface. Both of these factors have detrimental impact on the electromigration...
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