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Nowadays, major trends in the design of electronic products are toward multifunction and miniaturization. To meet these trends, system-in-package (SiP) has been adapted as one of the core packaging technologies for many product applications. Among the various types of SiPs, SiP with embedded dies has become important due to the smaller size achieved through embedded dies and better electrical performance...
Flip chips using Pb-free solders and electroless Ni-P UBMs on organic substrates are prone to a brittle failure before underfilling resulting in a low assembly yield. To investigate the reliability of Pb-free solder flip chip joint before underfilling, thermal cycling test and failure analysis were performed with SnAgCu solder/electroless Ni-P UBM flip chip. As a result, 15 percents of solder joints...
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