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In this study, electromigration behaviors of Sn3.0Ag0.5Cu solder flip chip using electoless Ni-P UBM were investigated. In anode solder joint, UBM was completely depleted and crack was observed. In the top view of consumed UBM, we could observe several holes on Ni-Sn IMC backfilled by Sn. Anode solder joint was disconnected by the large cavity under this consumed UBM. In the in-situ observation, UBM...
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