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Effect of solidification cooling rate on Ag3Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag3Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate...
The relation between cooling rate and morphology of Ag3Sn IMCs was investigated in this study. The morphology of Ag3Sn intermetallic compounds of eutectic Sn-3.5Ag solder was investigated after solidification at different cooling rates. As the nucleation time of Ag3Sn depended on cooling rate, the morphology and size of Ag3Sn compounds were affected by cooling rate. The three types of Ag3Sn compound...
The goal of this research is to evaluate the effects of La addition on the microstructure and microhardness of Sn-Ag based solders. Sn-3.5Ag-xLa ternary alloy solders were prepared by adding 0-1.0 wt% La into a Sn-3.5Ag alloy. Copper substrates were then dipped into these solders and aged at 150degC for up to 625 hours. The microstructure and microhardness of the as solidified solder and the aged...
The goal of this research is to evaluate the effects of La addition on the microstructure and microhardness of Sn-Ag based solders. Sn-3.5Ag-xLa ternary alloy solder were prepared by adding 0-1.0 wt% La into a Sn-3.5Ag alloy. Copper substrates were then dipped into these solders and aged at 150degC for up to 625 hours. The microstructure and microhardness of the as solidified solder and the aged solder/copper...
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