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In this work, a hybrid random walk method is proposed for the thermal analysis of integrated circuits. Preserving the advantage of generic random walk method (GRW), i.e. the suitability for simulating local hot-spots, the proposed techniques largely reduce its runtime for accurate high-resolution simulation, and is suitable for the realistic pyramid-shape IC model. This is achieved by combining the...
For accurate thermal simulation of integrated circuits (ICs), heat sink components in chip package must be considered. In this letter, techniques based on the domain decomposition method (DDM) are presented for the 3-D thermal simulation of nonrectangular IC thermal model including heat sink and heat spreader. A relaxed nonoverlapping DDM algorithm is employed to convert the problem to subproblems...
Accurate and efficient thermal analysis for a VLSI chip is crucial, both for sign-off reliability verification and for design-time circuit optimization. To determine an accurate temperature profile, it is important to simulate a die together with its thermal mounts: this requires solving Poisson's equation on a non-rectangular 3D domain. This paper presents a class of eigendecomposition-based fast...
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