The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Several types of printed circuit boards with embedded optical glass fibers for board level optical interconnects are presented. Transmitter and receiver coupling elements were developed which are solder temperature resistant and align passively on the fiber ends of the embedded glass fibers. Further a cost-effective demonstrator system using FPGA, serializer/deserializer, VCSEL driver, and photodiode...
Radar sensors are already employed in production model vehicles e.g. for adaptive cruise control (ACC) systems. Further development of driver assistance systems has also led to the use of radar sensors in active safety systems (active brake assistance, collision warning, emergency braking, etc). However, the costs of manufacturing such radar-based systems, capable of gathering reliable information...
We present multi channel optical interconnects, based on integrated glass fibers, with passively aligned in-plane and 90deg out-of-plane couplers for printed circuit boards. The out-of-plane coupler features micro optics, mechanical alignment structures, and a snap-fit system to assemble the complex coupler out of several simple, self aligning parts. Further we present an optical printed circuit board...
A novel system-in-package technology has been developed which enables to bury active 77 GHz chips inside a printed circuit board (PCB). The chips are connected to an RF substrate on top of the PCB using microvias. To evaluate the performance of these interconnects, silicon daisy chain chips with coplanar lines are buried inside a PCB. Simulation and measurement data are compared. The embedding technology...
This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.
In this paper we present a board level optical interconnect based on embedded standard multimode glass fibers and novel surface mounted coupling elements for passive alignment. The coupling elements are placed onto fiber stubs extending into milled openings in the optical PCB and provide a low loss butt coupling without the need for focusing optics or mirrors. Now we present for the first time temperature...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.