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In this paper, we reported thermally conductive insulating phase change materials filled with Al2O3-coated Al powder (PCMs/Al@Al2O3) and investigated the effect of composite PCMs on the thermal conductive performance. Result revealed that the content of Al@Al2O3 combines the advantages of both aluminum and alumina. The PCMs/Al@Al2O3 has a thermal conductivity value of 1.6743 w/mk, which is three times...
In this paper, we reported the performances of epoxy conductive adhesives filled with a low-melting-point Sn-Bi-Ag alloy. Results revealed the excellent stability, mechanical property of the Sn-Bi-Ag epoxy adhesives. Meanwhile, the thermal conductivity increased by increasing the content of Sn-Bi-Ag filler and 18 W m−1 K−1 can be obtained with 85% Sn-Bi-Ag filler content.
Electroplating is used here to fabricate a SnAgCu eutectic solders coating on copper substrate. The optimized coating is composed of Sn, Ag and Cu with the weight ratio of 96.4∶3.0∶0.6. Its melting temperature was confirmed at 215–220 °C. The coating thickness was controlled at 10 µm and its thermal conductivity reaches up to 56.7 W/mK.
Al2O3 coated graphene foam (GF@Al2O3) composites are proposed by depositing insulating Al2O3 particles on the graphene with a simple method. The content of Al2O3 on graphene could be gradually adjusted by changing Al(OH)3 radio in solution. Al2O3 coated graphene foam composites are used as effective three dimension (3D) interconnected framework of paraffin phase change materials to increase thermal...
Graphene oxide (GO) films are fabricated by direct evaporation of GO suspension on Cu foils under mild heating, and ultrathin paper-like reduced graphene films are produced by reducing graphene oxide films on Cu foils in H2-containing atmosphere at different temperature. Further investigation demonstrates that the reduced graphene film with ∼15um in thickness not only possesses high electrical conductivity...
Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between Al blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.
Graphene foam (GF), carbon fibers (CFs) and GF/CFs reinforced epoxy resin composites were fabricated and their thermal properties were investigated. Due to continuous interconnected structures of GF and avoiding the CFs aggregation in epoxy resin, GF/CFs reinforced epoxy resin demonstrates greatly higher thermal conductivity than the single GF or CFs reinforced epoxy, which could provide a strong...
Graphene nanosheets are prepared by electrochemical exfoliated of graphite in aqueous electrolytes. After exfoliation, the electrolyte containing exfoliated graphite is filtered. Then the precipitate is repeatedly washed using ultrapure water, and dispersed in ultrapure water for centrifuging separation. Finally, the above graphene dispersion is collected to fabricate graphene films. The graphene...
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