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A Sn-3.0Ag-0.5Cu (SAC) composite solder was fabricated by adding 0.1% weight percentage of multilayer graphene. The process steps are detailedly introduced in this paper. The physical, thermomechanical, wetting, mechanical properties were tested. Experimental results present that density and coefficient of thermal expansion of plain solder are higher than those of composite solder, while the thermal...
A novel approach for the fabrication of α-Al2O3, mullite (Al6Si2O13) and AlN multiphase ceramic layer on WCu via sintering process accompanied with mixing PCS/AlN composite slurry by ball milling was described. The sintering process parameters such as water vapor content and raw material ratio were mainly studied in this paper which greatly affected the formation of ceramic layers. At last, the interfacial...
A novel approach for the fabrication of α-Al2O3, mullite (Al6Si2O13) and AlN multiphase ceramic layer on WCu via sintering process accompanied with mixing PCS/AlN composite slurry by ball milling was described. The sintering process parameters such as water vapor content and raw material ratio were mainly studied in this paper which greatly affected the formation of ceramic layers. At last, the interfacial...
As-reflowed Sn-Ag-Cu solder joints in various diameters were found to contain only several beta-Sn crystal grains. With the solder joints increasingly miniaturized, there is no obvious change in the grain number in a solder joint. The aged Sn-Ag-Cu solder joints are composed of very limited number of beta-Sn crystal grains as well. It appears that the solder joint size and thermal aging have less...
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