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In power device package development, super high thermal performance adhesive either solder or polymeric adhesive are highly desired for better thermal resistance and RDSON. High thermal polymeric adhesive consists of high silver loading, unique thermoset resin, and solvent. Solvent evaporates during oven curing, silver flakes will be compacted to generate high thermal and electrical conductivity....
In TO220 FullPAK high voltage application, matrix leadframe design increases leadframe density and provides consistent isolation thickness. Tie bars removal exposes 0.8 mm length × 0.4 mm width metal holes, filling with minimum 15 kV/mm dielectric strength insulation material is required to prevent arching. Three unique filling materials, which include an UV cure material, one part and two parts components...
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