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This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author's group have studied the Manson-Coffin's law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu solder, because this solder is attracted...
This paper presents the ultrasonic welding technique for the copper terminals of large current, high reliability IGBT modules. Investigated topics are the strength of the bonding inferred from the microstructure, the effect of terminal bonding location on the damage to the insulator layer of module structure, and the reliability of large IGBT modules with the ultrasonic welding comparing with conventional...
This paper presents mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. The authors proposed an isothermal fatigue test method using real size solder joints to get the fatigue properties. The Manson-Coffin's law given by this method could improve the agreement between the simulation model and experimental results. Based upon the Manson-Coffin's law...
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