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This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author's group have studied the Manson-Coffin's law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu solder, because this solder is attracted...
The thin-film transistor liquid crystal display (TFT-LCD) industry has in recent years demanded ever-larger- area substrate processing capability to keep up with consumer market demands for larger and larger displays. This paper discusses the latest plasma-enhanced chemical-vapor deposition (PECVD) system, the AKT 50 K PECVD, which handles up to 2160 x 2460 mm2 substrates. As substrate size increases,...
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