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In this paper, we present the copper-copper bonding technique by ultrasonic welding for the copper terminals of large current, high reliability IGBT modules. Investigated topics are joint strength indicated from joint microstructure, the effect of copper hardness on joint strength, the relationship between terminal bonding location and the damage to the insulator layer in the module structure, and...
This paper presents the ultrasonic welding technique for the copper terminals of large current, high reliability IGBT modules. Investigated topics are the strength of the bonding inferred from the microstructure, the effect of terminal bonding location on the damage to the insulator layer of module structure, and the reliability of large IGBT modules with the ultrasonic welding comparing with conventional...
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