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Srinivas Chada, the current Chair of the TMS Electronic, Magnetic & Photonic Materials Division (EMPMD) and advisor to JOM for the Electronic Packaging & Interconnection Materials (EPIM) Committee of EMPMD, coordinated the topic of Progress with Lead-free Solders in this issue.
He is the advisor to JOM from the Electronic Packaging/Interconnection Materials Committee of the Electronic, Magnetic & Photonic Materials Division of TMS.
He is the current advisor to JOM from the Electronic Packaging & Interconnection Materials Committee of the Electronic, Magnetic & Photonic Materials Division of TMS.
He is the current advisor of JOM and chair for the Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic & Photonic Materials Division of TMS.
He is the advisor to JOM and chair for the Electronic Packaging & Interconnection Materials Committee of the Electronic, Magnetic, & Photonic Materials Division of TMS.
Alloys that undergo solidification over a wide range of temperatures generally exhibit a difference in the contraction behavior of the ensuing solid and liquid phases. Furthermore, dissolution of substrate metals during process reflow can lead to shifts in phase composition, additional primary phases, and volumetric contraction artifacts. The extent and frequency of surface roughness, shrinkage voids,...
Statement of problem. Implant survival depends on proper and timely oral hygiene maintenance, and a wide variety of oral prophylaxis procedures have been recommended and used on implant abutments. Purpose. This in vitro study compared the surface quality of both commercially pure titanium and titanium-alloy implant abutments, subjected to various hygiene methods and instruments with a standardized,...
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