Search results for: T. Uematsu

Items from 1 to 20 out of 57 results

article

Relationship between Surface Cracks and Distribution of Crystalline Silicon Grains in RF-Sputtered β-FeSi2 Films

T. Uematsu, K. Nakamura

Procedia Engineering > 2016 > 139 > C > 112-116

Applications in high-efficiency Si/β-FeSi₂ heterojunction solar cells require the preparation of crack-free β-FeSi₂ films on silicon. In this study, we obtained crack-free β-FeSi₂ films on silicon(100) just substrate by RF-Sputtering using FeSi₄ target even though we annealed the films at temperatures as high as 900°C after deposition. These films contained numerous silicon crystalline grains because...

chapter

Multicore fibre-based mode multiplexer/demultiplexer for three-mode operation of LP₀₁, LP_11a, and LP_11b

K. Takenaga, H. Uemura, Y. Sasaki, S. Nishimoto, more

2014 The European Conference on Optical Communication (ECOC) > 1 - 3

2014 European Conference on Optical Communication (ECOC)

A mode multiplexer/demultiplexer with a fused-fibre fan-in/fan-out device for three-mode operation of LP₀₁, LP_11a, and LP_11b is demonstrated using a partially elongated multi-core fibre. A fabricated mode multiplexer/demultiplexer exhibited a coupling efficiency greater than 79% over the C band.

chapter

Mode multiplexer/demultiplexer based on a partially elongated multi-core fiber

H. Uemura, Y. Sasaki, S. Nishimoto, T. Uematsu, more

OFC 2014 > 1 - 3

2014 Optical Fiber Communications Conference and Exhibition (OFC)

A mode multiplexer/demultiplexer based on a partially elongated multi-core fiber is designed and fabricated. The mode conversion from the LP₀₁ mode to the LP₁₁ mode at two wavelengths is demonstrated by changing the elongating condition.

chapter

Low-loss and broadband PLC-type mode (de)multiplexer for mode-division multiplexing transmission

T. Uematsu, K. Saitoh, N. Hanzawa, T. Sakamoto, more

2013 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC) > 1 - 3

2013 OFC Collocated National Fiber-Optic Engineers' Conference. OFC/NFOEC 2013

Two types of low-loss and broadband mode (de)multiplexer based on PLC are designed and fabricated. Multiplex/demultiplex of LP₀₁ and LP₁₁ modes is achieved with a low loss over a wide wavelength range.

article

104 The Ultrasound Images of Ductal Carcinoma in Situ – Frequency of Non-mass Abnormalities

K. Tanaka, K. Takahashi, A. Ogiya, Y. Tadokoro, more

European Journal of Cancer > 2012 > 48 > Supplement 1 > S71

article

P283 Is hormone therapy alone efficacious as postoperative adjuvant therapy in Japanese Stage I, HR+/HER2+ breast cancer patients?

A. Ogiya, M. Kikutani, N. Nishikawa, Y. Tadokoro, more

The Breast > 2011 > 20 > Supplement 1 > S68

article

Fabrication of tactile sensor array using microcantilever with low-TCR nickel-chromium alloy thin film for slippage detection

M. Sohgawa, D. Hirashima, Y. Moriguchi, T. Uematsu, more

Procedia Engineering > 2011 > 25 > Complete > 627-630

A tactile sensor has been fabricated using NiCr-thin-film strain gauge with low noise by surface micromachining and slippage has been detected by using the tactile sensor. NiCr alloy thin film of Cr: 75wt% has very low temperature coefficient of resistance (TCR) and is employed for suppressing the temperature noise and drift. The fabricated tactile sensor with NiCr thin film (Cr: 75wt%) has linear...

chapter

Development of high accuracy wafer thinning and pickup technology for thin wafer

C Miyazaki, H Shimamoto, T Uematsu, Y Abe, more

2010 IEEE International 3D Systems Integration Conference (3DIC) > 1 - 4

2010 IEEE International 3D Systems Integration Conference (3DIC)

We have evaluated accurate wafer thinning and picking up die technology around 10? m thickness. We obtained the prospect that thickness accuracy 10±1? m which is the target of the ultra thin grinding, by applying new technology like non-contact gauge or Auto TTV. The thickness distribution of the wafer with the glass achieved the sample of TTV:2.9? m, and the thickness accuracy of a real wafer became...

article

Abstracts: Development of youthful‐looking makeup foundation by controlling transmitted light

K. Uehara, K. Minami, H. Iwamoto, M. Osada, more

International Journal of Cosmetic Science > 32 > 5 > 393 - 393

pp.48–56 Based on the factor analysis of facial appearance using facial texture images, it was found that evenness of skin produced a youthful appearance. We developed a new composite powder which has the optical property to provide ‘youthful‐looking’ skin. Facial images of 161 women volunteers with make‐up were prepared, and the appearance of skin and face were evaluated by 15 subjects. The results...

chapter

Development of high accuracy wafer thinning and pickup technology for thin wafer(die)

C Miyazaki, H Shimamoto, T Uematsu, Y Abe, more

2010 IEEE CPMT Symposium Japan > 1 - 4

2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

Accurate wafer thinning and picking up die technology around 10μm thickness were evaluated. We obtained the prospect that thickness accuracy 10±1μm which is the target of the ultra thin grinding, by applying new technology like Non-contact gauge or Auto TTV. For picking up the ultra thin dies, we found the best tool design rule and some machine condition in slider peel method.

chapter

Development of wafer thinning and dicing technology for thin wafer

C. Miyazaki, H. Shimamoto, T. Uematsu, Y. Abe

2009 IEEE International Conference on 3D System Integration > 1 - 4

2009 IEEE International Conference on 3D System Integration (3DIC)

Various stress relief and dicing methods are evaluated for 10 to 30 mum wafer thickness. DP(Dry Polish) and CMG (Chemical Mechanical Grinding) are the best solution for productivity and quality in wafer thinning. Highest die strength is achieved for the blade dicing and DBG (Dicing Before Grinding) due to the decreased backside chipping in thin wafer. As for DBG, it is necessary to improve the resin...

chapter

Characterization of MOS transistor after through-hole electrode fabrication and 3D-assembly by mechanical caulking

M. Kawashita, Y. Yoshimura, N. Tanaka, H. Shimokawa, more

2009 59th Electronic Components and Technology Conference > 360 - 364

2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

Three-dimensional (3D) packaging technology has recently been developed for System in Package applications. The 3D packaging technology with through-hole electrodes has been receiving an especially great deal of attention because through-hole electrodes technology results in compact and high-performance systems. We have developed a new chip-to-chip interconnection method using mechanical caulking...

chapter

CCFL Inverters

T. Uematsu

Wiley‐SID Series in Display Technology > LCD Backlights > Light Source Devices > 103 - 115

This chapter contains sections titled: Introduction Various Drive Schemes of CCFL Inverters Equivalent Circuit of CCFLs Inverter Circuits Driving of CCFLs with Inverters Lamp Current Balancers for Driving Multiple Lamps Conclusions References

article

Through-Silicon via Interconnection for 3D Integration Using Room-Temperature Bonding

N. Tanaka, Y. Yoshimura, M. Kawashita, T. Uematsu, more

IEEE Transactions on Advanced Packaging > 2009 > 32 > 4 > 746 - 753

One approach to 3D technology is chip stacking using through-silicon vias (TSVs). Interconnects in a 3D assembly are potentially much shorter than in a 2D configuration, allowing for faster system speed and lower power consumption. However, it is extremely important to use cost-effective process technologies in practical use. Therefore, in our study, we propose a basic concept for interconnecting...

chapter

Characterization of MOS transistors after TSV fabrication and 3D-assembly

N. Tanaka, M. Kawashita, Y. Yoshimura, T. Uematsu, more

2008 2nd Electronics System-Integration Technology Conference > 131 - 134

2008 2nd Electronics Systemintegration Technology Conference

Room-temperature bonding by means of mechanical caulking to electrically interconnect stacked chips using through-silicon vias can greatly reduce process cost. We have already demonstrated the feasibility of this approach in several test samples. However, in a three-dimensional system-in-package sample containing a commercially available microcomputer unit, we encountered some difficulties in manufacturing...

article

Formation of nano-columnar amorphous carbon films via electron beam irradiation

Tatsuhiko Aizawa, E. Iwamura, T. Uematsu

Journal of Materials Science > 2008 > 43 > 18 > 6159-6166

Electrical beam (EB) irradiation is used to chemically modify the amorphous carbon film, a-C:H, which is prepared by the DC magnetron sputtering. The starting a-C:H film has vague columnar structure with lower density intercolumns as predicted by Thornton structure model. The EB-irradiated a-C:H film has fine nano-columnar structure with the average columnar size of 10–15 nm. This size is equivalent...

article

Abstract No. 318: Percutaneous Radiofrequency Ablation for Palliation of Pain Due to Primary Bone and Soft Tissue Tumor

A. Sawada, T. Aramaki, K. Asakura, T. Uematsu, more

Journal of Vascular and Interventional Radiology > 2008 > 19 > 2 Supplement > S117-S118

article

Solvent diffusion in a gel when escaping the confining polymer cage

C. Svanberg, D. Engberg, T. Uematsu, D. Andersson, more

The European Physical Journal Special Topics > 2007 > 141 > 1 > 273-276

. The diffusive motions of propylene carbonate contained in a deuterated poly(methyl methacrylate) gel is investigated using quasi-elastic neutron scattering. The solvent motion is probed at length-scales up to the typical distance between chains in order to characterize the dynamics of the solvent escaping its confining polymer `cage'. The experimental data are well described by a model based on...

chapter

Steady-State Characteristics of a Novel PFC Converter Operating in DCM

K. Fukushima, T. Uematsu, J. Yamamoto, K. Shimizu, more

2006 12th International Power Electronics and Motion Control Conference > 1682 - 1687

2006 12th International Power Electronics and Motion Control Conference

This paper proposes a novel PFC converter topology. The novel PFC converter is a buck-boost type and its output voltage is suppressed up to 200 V. As the result, the withstand voltage of any components can be reduced. That is possible to be higher efficiency and smaller size. Furthermore, the converter is easy to control when the converter operates in the discontinuous conduction mode (DCM). This...

article

— NNLO corrections to the first moment of gγ1 (x,Q2,P2) —

T. Ueda, T. Uematsu, K. Sasaki

Nuclear Physics B (Proceedings Supplements) > 2006 > 157 > 1 > 115-119

We present the next-to-next-to-leading order (ααs2) corrections to the first moment of the polarized virtual photon structure function g ^γ ₁ (x,Q2,P2) in the kinematical region Q2≫P2≫Λ2 in QCD. We find that the ααs2 corrections are about 3% of the sum of the leading (α) and the next-to-leading (ααs) contributions, when Q2=30∼100GeV2 and P2=3GeV2.

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Keywords

SILICON (5)
POWER GENERATION (4)
BIFACIAL CELL (3)
CONCENTRATOR MODULE (3)
INTEGRATED CIRCUIT INTERCONNECTIONS (3)
MECHANICAL CAULKING (3)
STATIC CONCENTRATOR (3)
TEMPERATURE 293 K TO 298 K (3)
3D ASSEMBLY (2)
BONDING PROCESSES (2)
CERAMICS (2)
ELECTRODES (2)
ELEMENTAL SEMICONDUCTORS (2)
ETCHING (2)
GLASS (2)
GRINDING (2)
HIGH ACCURACY WAFER THINNING (2)
INTERLEUKIN-6 (2)
LASER BEAMS (2)
MOSFET (2)
MULTIPLEXING (2)
OPTICAL MATERIALS (2)
PICKUP TECHNOLOGY (2)
POWER LASERS (2)
PROTEIN KINASE C (2)
SI SOLAR CELLS (2)
SOLAR CELLS (2)
SOLID LASERS (2)
SYSTEM-IN-PACKAGE (2)
TEMPERATURE (2)
THIN WAFER (2)
THREE-DIMENSIONAL INTEGRATED CIRCUITS (2)
THROUGH-SILICON VIAS (2)
YAGI-UDA ANTENNAS (2)
YTTRIUM COMPOUNDS (2)
PROSTAGLANDIN E 2 (1)
1.0 TO 1.125 MM (1)
1030 NM (1)
2.4 W (1)
29 PERCENT (1)
345 MW (1)
3D INTEGRATION (1)
3D SYSTEM-IN-PACKAGE (1)
3D-ASSEMBLY (1)
5-FLUOROURACIL HAIR ANALYSIS (1)
ACCURACY (1)
ADJUVANT CHEMOTHERAPY ORAL ADMINISTRATION COMPLIANCE (1)
ALUMINUM (1)
AMORPHOUS CARBON (1)
ANTIALLERGIC DRUG FK613 (1)
ASSEMBLY SYSTEMS (1)
AU STUD-BUMPS (1)
BACK-END METAL LAYERS (1)
BACKSIDE CHIPPING (1)
BIFACIAL MODULE (1)
BLADE DICING (1)
BLADES (1)
BONDING (1)
BONDING RATIO (1)
BONDING STATE (1)
BORON DIFFUSION (1)
BROADBAND COMMUNICATION (1)
BSF LAYER (1)
BUCK-BOOST TYPE (1)
CABLE INSULATION (1)
CALCIUM (1)
CARRIER LIFETIME (1)
CCFL INVERTERS (1)
CERAMIC LASER MATERIALS (1)
CERAMIC LASERS (1)
CHEMICAL MECHANICAL GRINDING (1)
CHIP SCALE PACKAGING (1)
CHIP STACKING (1)
CHIP-TO-CHIP INTERCONNECTION METHOD (1)
CHRONIC THYROIDITIS (1)
CONCENTRATOR CELLS (1)
CONDUCTORS (1)
CONVERTERS (1)
COUPLERS (1)
COUPLINGS (1)
CRACKS (1)
CRYSTALLINE MATERIALS (1)
CRYSTALLINE SILICON (1)
CYCLIC AMP (1)
DATA MINING (1)
DCM (1)
DEFORMATION (1)
DEFORMATION-INJECTION (1)
DICING TECHNOLOGY (1)
DIE STRENGTH (1)
DIE TECHNOLOGY (1)
DIELECTRIC FILMS (1)
DIELECTRIC THIN FILMS (1)
DIGITAL CONTROL OF INVERTERS (1)
DISCONTINUOUS CONDUCTION MODE (1)
DISTRIBUTION (1)
DRAM CHIPS (1)
DRIVE SCHEMES OF CCFL INVERTERS (1)
DRIVING CCFLS WITH INVERTERS (1)
DRY ETCHING (1)
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Elsevier (28)
ieee (17)
Springer (10)
Wiley (2)

INFONA - science communication portal

Search results for: T. Uematsu

Relationship between Surface Cracks and Distribution of Crystalline Silicon Grains in RF-Sputtered β-FeSi2 Films

Multicore fibre-based mode multiplexer/demultiplexer for three-mode operation of LP₀₁, LP_11a, and LP_11b

Mode multiplexer/demultiplexer based on a partially elongated multi-core fiber

Low-loss and broadband PLC-type mode (de)multiplexer for mode-division multiplexing transmission

104 The Ultrasound Images of Ductal Carcinoma in Situ – Frequency of Non-mass Abnormalities

P283 Is hormone therapy alone efficacious as postoperative adjuvant therapy in Japanese Stage I, HR+/HER2+ breast cancer patients?

Fabrication of tactile sensor array using microcantilever with low-TCR nickel-chromium alloy thin film for slippage detection

Development of high accuracy wafer thinning and pickup technology for thin wafer

Abstracts: Development of youthful‐looking makeup foundation by controlling transmitted light

Development of high accuracy wafer thinning and pickup technology for thin wafer(die)

Development of wafer thinning and dicing technology for thin wafer

Characterization of MOS transistor after through-hole electrode fabrication and 3D-assembly by mechanical caulking

CCFL Inverters

Through-Silicon via Interconnection for 3D Integration Using Room-Temperature Bonding

Characterization of MOS transistors after TSV fabrication and 3D-assembly

Formation of nano-columnar amorphous carbon films via electron beam irradiation

Abstract No. 318: Percutaneous Radiofrequency Ablation for Palliation of Pain Due to Primary Bone and Soft Tissue Tumor

Solvent diffusion in a gel when escaping the confining polymer cage

Steady-State Characteristics of a Novel PFC Converter Operating in DCM

— NNLO corrections to the first moment of gγ1 (x,Q2,P2) —

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