The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, we proposed a novel sensing scheme so-called Transmitter-Receiver Cooperative Sensing in a MIMO cognitive network by combining sensing information of both sides. Compared with most of the existing sensing schemes which simply use listen-before talk (LBT) only at the transmitter side, the proposed scheme can further improve the system performance by jointly feedback the Channel State...
This paper presents a study of the use of EMAT (Electromagnetic Acoustic Transducer) to generate and detect the single Lamb wave in the different thickness steel plate. Using an EMAT with a given wavelength, the desired single Lamb wave mode are generated and detected by controlling the center frequency of narrowband signals, and the center frequency of waves is about from 0.18MHz to 1MHz. The experimental...
Power delivery network (PDN) design continues to be a major challenge because it demands a good portion of available silicon, package, and board routing resources. In this paper, we outline a frequency and time domain co-design flow that uses frequency domain results to construct time domain input vectors, resulting in a resonance aware time domain analyses flow that can highlight low and mid frequency...
Reliable design of power distribution network for stacked integrated circuits introduces new challenges i.e., substrate coupling among through silicon vias (TSVs) and tiers grid in addition to reliability issues such as electromigration and thermo-mechanical stress, compared to conventional system on chip (SoC). In this paper a comprehensive modeling of the TSV and stacked power grid with frequency...
This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modeled and extracted in frequency domain which includes the impact of skin effect. The worst case power noise of the 3D power delivery networks (PDN) with local TSV failures resulting from fabrication process or circuit operation is identified...
In this paper, we propose an efficient flow for the analysis and co-design of large 3D power distribution networks (3D PDN). In this flow, the network is modeled in frequency domain and thus can take advantage of parallel computing. The proposed flow significantly reduces the CPU time while obtaining accurate results as compared to commercial simulation tools. In the established 3D PDN model, we incorporate...
Macroporous silicon technology is an important method to fabricate microchannels on silicon. The formation of insulator layer on the sidewall of the channels is necessary for electrical isolation or passivation of the surface. Oxidation is one of the preferred options. In this paper we investigate the effect of various oxidation processes on the smoothness of the sidewalls of the high aspect ratio...
Optimization of drug delivery through human skin is important in modern therapy, and with the invention of painless microneedles makes it become true. This paper presents a novel fabrication process for a tapered hollow metallic needles array using nickel plating on the silicon microneedles molds. The silicon microneedles molds, with a shank height of 150-200 mum and 300 mum center-to-center spacing...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.