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This paper investigates the effects of underfill epoxy resin and silicone gel elastomer on packaging induced thermal mechanical stresses for a simplified double-sided cooling power package using finite element method. Visco-elastic and hyper-elastic constitutive models were used to simulate the non-linear material properties. The results were compared to the models with linear elastic material.
In this paper several heat dissipation mechanisms are studied in an effort to improve heat dissipation of a high-power packaged chip in its environment. Specifically we examine a cavity-down structure consisting of a copper plate in thermal contact with the back side of the chip. In order to evaluate the thermal performance of the cavity-down approach, three structures are compared via simulation...
Electronic equipment with sealed enclosures are used in many applications where ruggedness and harsh environment are governing factors. However, the reliability of such equipment will depend on the effective heat rejection capability. Thus, an optimized thermal design is of paramount importance. In the present paper, thermal analysis of a sealed electronic rack is described. Finite Element code NISA...
Concentrated photovoltaic (CPV) systems dramatically reduce the size of the solar cell. However, they add thermal load to the solar cell which reduces its efficiency. This reduction is due to an increase in temperature, which is largely dependent on the thermal characteristics of the solar cell carrier. From 1 to 2000X solar concentration, we conducted thermal finite element simulations to determine...
Interface delamination is one of the most important issues in the microelectronic packaging industry. Silver filled die attach is a typical adhesive used between the die and copper die pad for its improved heat dissipation capacity. Delamination between die attach and die pad will severely impact the heat conduction and result in product failure. In order to predict this delamination, interface properties...
A physical yet analytical phase change memory (PCM) model simultaneously accounting for thermal and electrical conductivities is presented. Due to the physics based nature of the model, the essential temperature from heating and cooling of PCM during operation is instantaneously updated. More importantly, the model can be applied to non-conventional circuit design technique. We show that for the first...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
Bulk nanostructured (Bi,Sb)2Te3 compounds and GeTe based amorphous/nanocrystal composites have been successfully fabricated by the combined hydrothermal/hot-pressing and quenching/annealing methods, respectively. The (Bi,Sb)2Te3 nanopowders synthesized by hydrothermal method exhibit a hollow-like structure. After hot-pressing, the nanoscale grains varying from tens to hundreds of nanometers were found...
Cooling is important to keep the temperatures of the highly integrated silicon electronic devices and power devices e.g. power MOSFET, IGBT. Yamaguchi et al. have proposed a new scheme to cool down the devices by its own current named ldquoself-cooling devicerdquo, in which the cooling process uses Peltier effect. In the proposed scheme, we should use the materials that have high thermal conductivity,...
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