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On one hand, with the rapid increase of integrated circuits (ICs) I/O number, the traditional package technique does not meet the need of pioneer development. On the other hand, three-dimensional integrated circuits (3-D ICs) become more and more popular to satisfy the multi-function chip development. One of the best solutions of these needs is the ultra-fine pitch micro-bumps. The micro-bumps can...
As the market demands for high performance, miniaturized, better reliability and lower-priced portable electronic products, the integration of a system into three-dimensional (3D) chip stacking packages are presently used to achieve these targets. Even though the miniaturization of system scaling, low power consumption and better electrical performance can be performed by 3DIC packaging technologies,...
After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to temperature coefficient of expansion mismatch between the respective materials within the package as it cools to room temperature. The maximum Von Mises stress or principle stress criterion based on stress analysis and maximum energy release rate criterion based on fracture mechanics are two of the most...
This paper presents the development of a high power module package having improved its electrical performance optimizing the package structure and the circuit layout on a substrate throughout Finite Element Analysis (FEA). The result of FEA shows that the modeling is finely calibrated from the verification, that is, comparing it with actual measurement values of several types of design configuration...
As the bond pitch size decreases, understanding the behaviour of the capillary tube and monitoring bond quality becomes increasingly important. This paper uses finite element analysis (FEA) and laser Doppler interferometer to study the vibration of the capillary tube during the wire bonding process. Using a laser Doppler interferometer, the vibrations were measured along the x, y and z axis under...
The existing IPC/JEDEC of moisture/reflow sensitivity classification determines the time of accelerated equivalent soak by the equivalency of moisture concentration at the critical interface with the standard sensitivity test. This paper proposes a new methodology of accelerated moisture sensitivity test based on the equivalency of both local moisture concentration and overall moisture distribution...
Scanning acoustics microscopy (SAM), Moire interferometry and Finite Element Analysis (FEA) based predictions has been largely used in package reliability study to deliver results critical to the thermo-mechanical risk assessments. Complementary to these tools, a novel method of package stress analysis, which involved directly measuring the deformation of an actual package, have been developed, and...
This paper described the shadow moire measurement of bare flip chip coreless and standard (3/2/3) BGA substrate to inspect the change of each thermal history (0hr, after pre-baking, fR-reflow), the warpage increased significantly on IR reflow peak temperature and largest warpage located around the C4 area of coreless FCBGA substrate and standard FCBGA substrate change was not obvious. Electrical performance...
Integration of copper (Cu) and low-k dielectrics has posed significant challenges for device reliability and packaging. For faster and successful semiconductor product introduction, early implementation of simulation model for physics and mechanical studies, and the subsequent design for manufacturability (DFM) are important considerations for device reliability and packaging communities. In this...
In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters...
Underfilling with capillary liquid encapsulants is a common process for the majority of flip-chip packages. A secondary process with plastic encapsulation using a molding compound may follow, serving to protect the die from mechanical damage. Due to the need to cost savings, recent developments of suitably engineered epoxy molding compounds have made a single step transfer underfilling/overmolding...
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