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The morphology of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. This paper investigated the effect of interfacial IMC (Intermetallic Compound) morphology on mechanical properties of solder joint by finite-element method. The joint model is consisted of copper, Cu6Sn5 interfacial IMC and Sn-3.0Ag-0.5Cu solder alloy. The surface of interfacial...
The reliability life assessment of electronic packages is a key issue to ensure the mass production quality of packaging components. To meet the time-to-market and long term reliability requirements, using finite element to predict a precise life cycle of solder joints becomes the main trend of electronic packaging product development. Thermal cycling test is a standard test and has been widely used...
A new analysis method for solder joint fatigue life prediction is introduced. The method utilizes a combination of finite element method (FEM) and peridynamic (PD) theory. The thermal cycle simulation is performed using FEM to obtain deformation field, which is imposed as boundary conditions to the PD model. Fatigue crack initiation and its progression is captured in PD simulations. The approach is...
The microcracking behavior of the IMC layer is investigated numerically, and the effect of the thickness of the IMC layer on the overall response and failure mode of the solder joint is studied using qualitative numerical simulations. The results show that the thicker IMC layer results in lower overall strength. When the IMC layer is thin, the microcracks tend to start at the valley of the rough solder/IMC...
A thermal-mechanical coupled finite element analysis model of solder joints is established, which plays a role in mechanical support and electrical connection in flip chip. Periodic temperature cycle load (−45°C∼125°C) applied on the solder joints and it will generate periodic internal stress and strain in the process of the temperature cycling. With repeat using, the solder joints will produce deformation,...
The 3D finite element analysis models of lead-free solder joint with compliant layer in wafer level chip scale package (WLCSP) were developed. Based on the models the lead-free solder joint with compliant layer stress and plastic strain were analyzed under thermal cycle. The results showed that: under thermal cycle loading conditions, the equivalent stress and equivalent plastic strain of the lead-free...
In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder...
The 3D finite element analysis models of lead-free solder joint with compliant layer in wafer level chip scale package (WLCSP) were developed. Based on the models the lead-free solder joint with compliant layer stress and plastic strain were analyzed under thermal cycle. The results showed that: under thermal cycle loading conditions, the equivalent stress and equivalent plastic strain of the lead-free...
The microcracking behavior of the IMC layer is investigated numerically, and the effect of the thickness of the IMC layer on the overall response and failure mode of the solder joint is studied using qualitative numerical simulations. The results show that the thicker IMC layer results in lower overall strength. When the IMC layer is thin, the microcracks tend to start at the valley of the rough solder/IMC...
A thermal-mechanical coupled finite element analysis model of solder joints is established, which plays a role in mechanical support and electrical connection in flip chip. Periodic temperature cycle load (−45°C∼125°C) applied on the solder joints and it will generate periodic internal stress and strain in the process of the temperature cycling. With repeat using, the solder joints will produce deformation,...
In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder...
In this paper, the effect of the various thickness of the solder joint between the SMD (Surface Mound Device) chip resistor and the PCB (Printed Circuit Board) pad on the mechanical strength was investigated with FEM (Finite Element Method) simulation. The mechanical effect was studied for different solder alloys too; lead-free and lead-bearing alloys were compared together. A FEM program was used...
In this paper, thick film chip resistors with two different types of solder alloys namely SnPb and SnAgCu have been evaluated for the effects of the solder alloy elemental composition on the solder joint failures under cyclic temperature loading conditions. The creep properties of both solders have been modelled using the Garofalo equation and the creep strain energy density has been extracted and...
The thermal fatigue and mechanical fatigue are the two main failure modes for board level solder joint in SMT. The comparison investigation of thermal fatigue and mechanical fatigue behavior of solder joint are carried out by experimental method in this study. The surface mounted test PCB is used and two kinds of solder materials, including SAC305 and Sn37Pb, are considered. It is shown that lead-free...
Vibration is commonly encountered during the life time of electronic components. It is a major cause of failure due to cyclic strain and stress that give rise to damage in the materials making up the component. The recent move from lead to lead-free soldering by the electronics industry has necessitated the generation of material properties data that will allow accurate prediction of the lead-free...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
This paper proposes a new prediction method for electromigration (EM) induced void generation of solder bumps in a wafer level chip scale package. The methodology is developed based on discretized weighted residual method in a user-defined finite element analysis framework to solve the local ME governing equation with the variable of atomic concentration. The local solution of atomic concentration...
The requirement for smaller devices but with much greater performance leads to a boost in current density and damage caused by electromigration. Recently, some researches show that the grain orientation changes during current stressing. In this study, the solder of SnAg2.6 with 2 um-thick UBM layer of Ni and 20 um-thick copper pad is used. Electron Backscattered Diffraction (EBSD) is applied to investigate...
In this paper, according to the condition B in the drop test standard of JEDEC, create 3D finite element model of VFBGA (very-thin-profile fine-pitch BGA) packages in drop and impact, the material model of solder joints can be indicated by Cowper-Symonds model obtained from experiment data, taking into the consideration of strain rate and temperature effect. Comparing with traditional elastic for...
This paper presents an investigation on field returned open and short failures related to printed circuit board (PCB), including via hole crack, prepreg crack and insufficient circuit etching. After an experimental study with cross section, time domain reflectometry (TDR), and finite element (FE) modelling, it was found that weak plating and corrosion induced via hole crack was a major root cause...
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