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Through silicon via (TSV) based 3D integrated circuits (ICs) have become a popular approach to revive Moore's law. However, the reliability of a TSV is an important issue, as a faulty TSV can result in the failure of the entire 3D IC. Most of TSV faults can be detected during the testing process, however, detecting TSV aging faults during the testing process is impossible. Certain mechanisms are required...
TSV-based 3-D IC is one of the most promising approach in modern integrated circuit design. As TSV enables the integration of different dies with different technologies, it is considered as one of the key elements in IC design. Reliability of TSV is an important issue which needs to be addressed very carefully since a faulty TSV can result in the failure of the whole stack. TSV open defect alongside...
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