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The additive nature and high resolution of electrohydrodynamic inkjet (E-jet) printing can be utilized for manufacturing micrometer scale conductive tracks such as those required in the high-density redistribution layers (RDLs) of silicon interposers used in electronics packaging for 3-D integration. Compared to the current lithographic fabrication method, this approach promises to increase the customizability...
Through silicon vias (TSVs) have been used in 3D packaging of microelectronic devices and MEMS devices, where they provide electrical interconnections through the stacked wafers and devices. Currently, chemical vapor deposition (CVD) or electroless deposition are used to partially or fulfill the vias. However, these methods are time consuming. Thus, the potential of inkjet printing to linearly fill...
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