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High power consumption & high input/out (IO) density are requested by modem electronic components such as high-density electronics, communication satellites, advanced aircraft, networking server and telecommunication devices. Challenges in the heat dissipation of an electronic package arise from the continued increase in power dissipation and power density of higher-power devices. A thermal interface...
In recent years, the wafer nodes of semiconductor are getting smaller and narrower. In the view of the development trends in the semiconductor & semiconductor packaging technologies, the higher signal LO pin counts and thinner package are wide-spread applied on consumer electronics products (ex: Smartphone, Tablet devices or Digital cameras) as well as high performance network systems and high-end...
The modulation spectra of speech features are often distorted due to environmental interferences. In order to reduce this distortion, in this paper we propose several approaches to normalize the power spectral density (PSD) of the feature stream to a reference function. These approaches include least-squares temporal filtering (LSTF), least-squares spectrum fitting (LSSF) and magnitude spectrum interpolation...
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