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Lead free solder materials are widely used in electronic packaging industry due to environmental concerns. However, experimental testing and microstructural characterization have revealed that Pb-free solders exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. These changes are especially large in harsh environments, where...
Leadfree solders have been used as interconnects in electronic packaging, due to its environmental friendly chemical property. However, those materials may experience high strain rates when subjected to shock and vibration. Consequently, failure will occur to electronics in those situations. Therefore, knowing the material properties of lead-free solders are extremely important, but research on mechanical...
Electronics subjected to shock and vibration may experience strain rates of 1–100 sec−1. High strain rate data is scarce for leadfree solders at strain rates in the range of 1–100 sec−1, typical of drop-impact, shock and vibration. A new experimental method has been developed to achieve constant strain rate in the neighborhood of 1 to 100 sec−1 during the entire deformation history. SAC105 and SAC305,...
The Anand viscoplastic constitutive model is often used to represent the deformation behavior of solders in electronic assemblies. In the Anand model, plasticity and creep are unified and described by the same set of flow and evolution relations. The nine parameters of the Anand constitutive model are typically determined from uniaxial stress-strain tests at several strain rates and temperatures using...
Electronics may experience high strain rates when subjected to high g-loads of shock and vibration. Material and damage behavior of electronic materials at high strain rates typical of shock and vibration is scarce. Previously studies have shown that second-level interconnects have a high propensity for failure under shock and vibration loads in fine pitch electronics. Exposure to shock and vibration...
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