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The increasing demand for lighter, thinner and flexible electronic devices are resulting in complexity in design. The 2D or planner devices miniaturization is reaching to its limit continuing its complexity in interconnect circuits causing limitation inefficient performance. To overcome the problem of complex interconnection and to introduce the more Compact device, the generation of 3D package rises...
The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch in Coefficient of Thermal Expansion (CTE) between the materials used in the package induces stress on the solder interconnects and results in deformation and stresses. Finite element tools are widely used for rapid design optimization and also...
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When an electronic device is turned off and then turned on multiple times, it creates a loading condition called power cycling. WLCSP use a package technology at the wafer-level, which...
Various studies have been conducted to study the effect of varying board thickness on thermo-mechanical reliability of BGA packages. Wafer level chip scale packages (WLCSP) have also been studied in this regard to determine the effect of PCB build-up thickness on the solder joint reliability [1]. The studies clearly demonstrate that the thinner Printed Circuit Boards (PCBs) result in longer thermo-mechanical...
The role of electronic packaging is becoming more important and now constitute a much bigger percentage of the development of package with high evolution due to strong and competing demands for increased functionality and performance, further miniaturization, heightened reliability, and lower costs. Various types of packages like BGA and Quad Flat No-Lead (QFN) are widely used. Ball Grid Array package...
New electronic devices with small size and low power consumption are in demand in recent years. Miniaturization and complex product are required in modern electronics for more functionality in the smaller electronic package. To overcome such issues, 3D packages or package on package (PoP) are introduced. The 3D packaging is stacking of chip on top of another which is emerging as a powerful technology...
New electronic devices with small size and low power consumption are in demand in recent years. Miniaturization and complex product are required in modern electronics for more functionality in the smaller electronic package. To overcome such issues, 3D packages or package on package (PoP) are introduced. The 3D packaging is stacking of chip on top of another which is emerging as a powerful technology...
QFN packages gained popularity among the industry due to its low cost, compact size, and excellent thermal electrical performance. Although PCBs are widely used for QFN packages in handheld devices, some customers require it for heavy industrial application demanding thicker PCB. When an electronic device is turned off and then turned on multiple times, it creates a loading condition called power...
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