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Experimental investigation of data center cooling and computational energy efficiency improvement through advanced thermal management was performed. A chiller-less data center liquid cooling system was developed that transfers the heat generated from computer systems to the outdoor ambient environment while eliminating the need for energy-intensive vapor-compression refrigeration. This liquid cooling...
The effective use of embedded radial expanding micro-channels with micro-pin fields for two phase cooling of a microprocessor die has been demonstrated. In this first part of a two part paper, the integration of this approach into a functional high performance server is presented. Modeling was conducted to design radial micro-channels, micro-pin fields, and orifices to properly distribute flow according...
Chip embedded two phase evaporative cooling is an enabling technology to provide intra-chip cooling of high power chips and interlayer cooling for 3D chip stacks. Utilizing an interconnect-compatible dielectric fluid provides a cooling solution compatible with chip to chip interconnects for future high power 3D chip stacks. However, lack of high fidelity and computationally manageable conjugate thermal...
The effective use of embedded radial expanding micro-channels with micro-pin fields for two phase cooling of semiconductor dies has been demonstrated [1, 2]. In this second part of a two part paper, the functional results of integrating this approach into a high performance server are presented. First, a number of microprocessor modules were fully characterized within a high performance server utilizing...
Thermal challenges in 3D ICs have driven the need for embedded chip cooling. In this paper, we measured the thermal performance of a two-phase system employing flow boiling in chip-embedded micro-channels utilizing the latent heat of vaporization of dielectric refrigerants (such as R-1234ze) In the present study, an investigation was performed on a 20 mm × 20 mm thermal test vehicle having a heater...
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