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Packaging technology is currently transitioning from flip chip technology toward three-dimensional integrated circuits (3D IC) packaging. In 3D ICs, smaller dimensions of the microbumps, approximately 10 µm, are adopted. In such small size of the microbumps, the current densities applied in the microbumps will dramatically increase. Furthermore, due to intense joule heating and current crowding, current...
Three-dimensional integrated circuit (3DIC) technology has become the major trend of electronic packaging in microelectronic industry. To effectively remove heat in stacked ICs, the temperature gradient must be established across the chips. Furthermore, because of the trend of even higher device current density, the joule heating would be more serious and the temperature gradient across the solder...
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