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Stable and spectrally narrow laser sources referenced to ultrastable passive Fabry-Pérot cavities are invaluable for optical atomic clocks and they find important applications, e.g. in precision tests of relativity or novel radar applications. Ultimately the fractional frequency instability of the laser is limited by Brownian thermal noise of the cavity constituents.
Fan-out wafer level packaging (FOWLP) not only provides simplified supply chain management and lower cost structure, but also enables thinner profile and heterogeneous system integration. FOWLP is becoming increasingly significant and is projected to drive growth in advanced packaging for the foreseeable future. There are many different processing technologies for fabricating FOWLP. One common key...
An experimental method was introduced for understanding the exact relationships among polarization, coercive field, and electric field across the ferroelectric layer. They characterized the ferroelectric properties closed inside the metal/ferroelectric/insulator/semiconductor gate stacks. Using the method, we found that N2-dominant-gas annealing process was effective for improving the ferroelectricity...
Precise Vg-pulse response of low-voltage FeFETs were systematically investigated for the first time. The FeFETs showed good reproducibility of the Vth values controlled by voltage height, time width, and number of the imposed Vg pulses. Parameter extractions of the static and dynamic ferroelectric characteristics are valuable for modeling the FeFETs and simulating the analog circuits. 10^9 cycle endurance...
As IC technologies continue scaling down, traditional electrostatic discharge (ESD) devices can no longer meet the demands of modern protection, prompting the need for novel device structures. A novel and unique approach to ESD protection using suspended graphene ribbon devices is presented. It has been demonstrated the ribbon's electro-mechanical response to a sudden surge of charge, such as an ESD...
Remaining useful life (RUL) prediction is a key link in prognostics and health management. More accurate RUL prediction results will lead to more reasonable decision making on sequential management activities including maintenance, replacement, spare parts ordering, etc. In engineering practice, many products exhibit more volatile degradation paths when they have high degradation rates. By this observation,...
In view of poor resin flexibility and easy to fall off of diamond grits during manufacturing process of single layer UV-curing resin diamond wire saw, a novel manufacturing approach of double layer UV-curing resin diamond wire saw is put forward. During the manufacturing process, a layer of UV-curing resin with a good pliability and strong binding ability is uniformly coated on the core wire surface,...
A FinFET doping method with PSG/BSG glass mimic doping was presented and a simplified process flow was introduced. Numerical simulation and experiment results of sheet resistance and SIMS profiles indicated a uniform doping of the 3D FinFET structure with the presented method, by using a proper dielectric layer and conducting an optimized subsequent annealing process.
3D WLCSP using via last TSV (through silicon via) technology is an ideal packaging technology to meet small-form-factor, high I/O density, high-speed and most important, lower cost. For thin 3D WLCSP with TSVs, a number of critical processes need to be developed such as oxide etch, via cleaning and wafer de-bonding. In the present paper, processes for 8 inch, thin WLCSP with TSV diameter of 40µm and...
Ion implantation technology is widely used in semiconductor manufacturing process. Most of install base for high current implanters use deceleration technology to overcome space charge effect especially important for low energy implants. It is necessary to consider the Energy contamination (EC) effects on devices with thinner gate height. This paper use SRIM simulation and dopant profiles, offline...
With network coding, data flows from the source to the destinations may be jointly coded in some intermediate nodes to achieve the maximum network capacity. There is scarcely any theory to systematically model and evaluate the loss of network coding. Without such a theory, the analysis of network coding under various settings is far from practical. To fill the vacancy, we introduce a loss model into...
Since more chips are fabricated within 3D-IC, the single layer TSV cannot satisfy the requirement. Hence, the multilayer TSV structure was proposed, and the influence of different bump radius, bump height, underfill material in the intermetallic layer on the TSV performance was studied. In reality, multilayer TSV array is applied in the product. Therefore two multilayer 4 × 4 TSV arrays have been...
It often brings electromagnetic compatibility problems when dense and complex cables lay in modern ship cabin. This paper tries to analyze the electromagnetic interference between power cable and shielded twisted-pair bundle with the transmission line theory and shielding theory. We take an experiment in the shielded room on the electromagnetic interference between the power cable and shielded twisted-pair...
In the dark silicon era, a fundamental problem is: given a real-time computation demand represented by a set of independent applications with their own power consumption, how to determine if an on-chip multiprocessor system is able to respond to this demand and maintain its reliability by keeping every core within the safe temperature range. In this paper, we first present a novel thermal model for...
This paper presents a new distributed control framework to coordinate inverter-interfaced distributed energy resources (DERs) in island microgrids. We show that under bounded load uncertainties, the proposed control method can steer the microgrid to a desired steady state with synchronized inverter frequency across the network and proportional sharing of both active and reactive powers among the inverters...
Broadband 1×4 thermo-optic switch is demonstrated based on four W2 photonic crystal waveguides with footprint of 17.6 µm×8 µm. Extinction ratio larger than 15dB is obtained over the bandwidth of 15±1 nm in each channel.
In this work, microwave annealing is explored to tune the Schottky barrier height between NiSi and Si via boron and arsenic dopant segregation using silicide as diffusion source scheme. The microwave annealing is found to be able to obtain equivalent electron and hole Schottky barrier heights at significantly lower temperature (>100 °C) compared with conventional rapid thermal annealing. A plausible...
Heating of silicon substrates featuring different resistivity values by microwave annealing is investigated. The absorption of microwave energy for silicon wafers is found to be consistent with ohmic conduction loss theory. The strongest absorption occurs when the resistivity was around 10 Ω·cm. As the carrier concentration and the conductivity of silicon increase with temperature, the absorption...
Collaborative spectrum sensing is an effective method to improve the detection rate in cognitive radio. However, it is vulnerable to spectrum sensing data falsification attacks. In order to improve the robustness, numerous attack prevention schemes have been proposed to identify malicious secondary users (SUs). Nevertheless, most of them neglect to incentivize SUs to send truthful reports. Therefore,...
This paper reports a patterning and metallization method for silicon solar cells fabrications. Patterning was achieved by the inkjet printing of a dye-based ink as a mask to protect the photoresist from UV-light initiated crosslinking. The patterned photoresist was used to facilitate the etching of a pattern in the underlying dielectric layer and also to act as a metal plating mask. This method resulted...
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