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The hydrodynamic and thermal characteristics of microchannel networks are investigated by finite element analysis with commercial software Fluent. The simulation model is based on fabricated thick film LTCC substrate with 3D cooling microchannels. A comparison of the cooling performance among fractal-shaped microchannel, parallel microchannel, serpentine microchannel, spiral microchannel is also conducted...
This paper investigates the additional iron loss generated in the laminated silicon sheets of the core or the magnetic shields of large power transformers due to the leakage flux. A verification model is well established, and an efficient analysis method is implemented and validated. Both the magnetic and electric anisotropy of the oriented silicon steel sheets are taken into account in 3-D FEM eddy...
Eutectic solders are prone to cold flow and creep in thermal cycle process and therefore prone to fatigue failures. In this paper, eutectic solder fatigue in a molded board level BGA module was studied through finite element analysis. Particularly, the effects of underfilling molding compounds to the stresses and fatigue life of solder balls were investigated. A global finite element model was built...
Packaging materials are important factors in cost, process, and performance of packaged devices. To minimize costs associated with redesign or rework, it is critical to select the right materials for a package at the design phase. Finite element analysis and other simulation tools have been widely used to optimize the target material properties and design parameters in microelectronic packaging. However,...
Warpage after molding is a critical issue for array packages due to singulation and soldering requirement in subsequent assembly. Warpage is greatly affected by package geometries, such as dimensions of matrix block, pad, die, and passive components, as well as molding compound properties. One set of molding compound properties may generate very low warpage in one array package, but generate unacceptable...
This paper proposes a simple method to take into account the influence of end-effect on flux-linkage and back-emf in both flux-switching permanent magnet (FSPM) and doubly-salient permanent magnet (DSPM) machines on the base of 3-D finite element analysis (FEA). A leakage factor kend is defined to scale the grade of the influence of end-effect on PM machines.
In this paper, performance of groups of underfill and molding compound material sets developed for a flip-chip SIP array package was evaluated. The failure modes were studied as variations of materials properties and processing conditions. Finite element analysis was conducted to provide theoretical support to the observations. It was found that both materials properties and process conditions had...
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