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Three CdII coordination polymers (CPs), named as {[Cd2(DDPP)(DMF)(H2O)]·DMF}n (1), {[Cd2(DDPP)(H2O)2]·DMA·H2O}n (2), [Cd(H2DDPP)]n (3), based on 3,5‐di(2′,5‐dicarboxylphenyl)pyridine) (H4DDPP), were synthesized under solvothermal methods. Structural analysis indicates that the H4DDPP ligand of 1–3 adopt (κ1‐κ1)‐(κ1‐κ1)‐(κ1‐κ2)‐(κ1‐κ1)‐μ8, (κ1‐κ1)‐(κ1‐κ2)‐(κ1‐κ2)‐(κ1‐κ1)‐μ10, and (κ0‐κ0)‐(κ1‐κ2)‐(κ...
Based on Hopkinson pressure bar, consulted existing literature, this essay has designed a Hopkinson pressure-shear device. This article introduces mainly components and principles of experiment equipment, then formulates the next stage of work.
In the paper, the compression deformation behavior in lead-free solders were conducted on a MTS-809 material tester at the temperature range of 233–398 K with the strain rate in the range of 0.001–0.1 s−1 and the height reduction of 60%. The results show that the stress-strain curves of lead-free solder Sn3.0Ag0.5Cu are influenced by temperature softening and strain rate hardening effects. Based on...
In this paper, creep behavior of the lead-free SnAgCu solder alloy after reflow process was investigated by use of Nano Indenter XP technology. Based on the steady-state power law creep relationship, the creep strain rate sensitivity exponent was determined from the indentation creep testing using dimensionless analysis method. Then, combining numerical simulation with dimensional analysis, the value...
In this paper, a new methodology to extract the elasto-plastic properties of lead-free solder materials from an instrumented sharp indentation loading curve has been proposed using dimensional analysis and finite element computation. The nano indenter XP technology is used to test samples of lead-free eutectic SnAgCu solder alloys to obtain a load-displacement curve, which can be used to calculate...
In this paper, a representative material cell containing a single microvoid is used to investigate void growth under combined vapor pressure and thermal stress. The plastic IC packaging material is assumed to be transversely isotropic and its strain energy includes a power-law reinforcing model has been analyzed. Using the theory of cavity formation and unstable void growth in incompressible hyper-elastic...
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