The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Due to their excellent microwave behaviour (low or moderate dielectric loss, highly conductive inks) and their hermeticity, LTCC materials are being widely used for MMIC packaging. The latter is often required to protect bare dies against the impact of harsh working conditions on the field. Several applications, such as front end modules for mobile communication or transmit modules for point-to-point...
Packaging of microwave components and systems for space use is very challenging since high frequency, thermal and hermeticity aspects need to be considered. Furthermore, these packages have to be reliable under various environmental work conditions. Ball Grid Array (BGA) or Land Grid Array (LGA) packages are typically used for microwave applications. BGAs are better investigated in terms of reliability...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.