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In this experiment, the vibrational performance of various lead-free doped (micro-alloyed) solder paste alloys on 15mm BGA packages were investigated. The Primary Goal of this test is to find a manufactureable solder paste that will mitigate the effects of aging on lead free solder joints. The results discuss the effects of different paste materials, the effects of doping level, and reflow profile...
Board level drop impact testing is one of the most important modes of evaluating the reliability of assemblies. This study examines the drop impact performance of no aged and isothermally aged flip chip packages on laminate assemblies for various doped lead-free solder paste alloys. A potential solution to replace the industrial standard solder paste Sn96.5 Ag3.0 Cu0.5 (SAC305) was carried out. The...
In this experiment, the thermal performance of various lead-free doped solder paste alloys on leaded and leadless packages on laminate substrates were investigated. The Primary Goal of this test is to find a manufactureable solder paste that will mitigate the effects of aging on lead free solder joints. The results discuss the effects of different paste materials, the effects of doping level, and...
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