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As dimensions shrink with each successive semiconductor technology node, the critical size of defects that can impact yield also shrinks. Monitoring the health of process equipment rigorously and regularly for key sources of contamination must be performed. Comparison of the critical feature size per technology node with the typical defectivity size used for process control shows a widening disparity...
During the bond and assembly process of an organic module, the backside of the chip will be in tensile stress. Vertical cracking through the Silicon chip (as shown in Figure 1) can occur when the strength of the chip is lower than the stress that is applied through the bond and assembly processes and associated materials.
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