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In emerging 3D NoC-based chip multiprocessors (CMPs), aging in circuits due to bias temperature instability (BTI) stress is expected to cause gate-delay degradation that, if left unchecked, can lead to untimely failure. Simultaneously, the effects of electromigration (EM) induced aging in the on-chip wires, especially those in the 3D power delivery network (PDN), are expected to notably reduce chip...
Transient faults due to single and multiple bit-flips are becoming increasingly common in today's multicore processing chips and reduce overall chip reliability. Simultaneously, aging effects due to phenomena such as Bias Temperature Instability (BTI) and Hot Carrier Injection (HCI) also gradually reduce chip reliability over time. Unfortunately, with technology scaling, the increasingly stringent...
The growing parallelism in most of today's applications has led to an increased demand for parallel computing in processors. General Purpose Graphics Processing Units (GPGPUs) have been used extensively to provide the necessary computation for highly parallel applications. GPGPUs generate huge volumes of network traffic between memory controllers (MCs) and cores. As a result, the network-on-chip (NoC)...
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