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Spectrum sensing is one of the major elements of cognitive radio applications. A single secondary user (SU) usually cannot provide robust sensing capability due to channel effects. In order to overcome this problem, cooperative spectrum sensing techniques have been proposed. Because conventional cooperative spectrum sensing schemes assumed that all sensing nodes have the same sensing reliability,...
In this paper, the failure number of hydroelectric power equipments in the whole life is predicted based on Crow-AMSAA Reliability Growth model. Considering influence of preventive maintenance to failure rate, service age reduction factor E is introduced to adjust service year of equipment and the maintenance cost model of hydroelectric equipments in the life cycle is derived. The optimal preventive...
The fan-out-type chip scale package (fan-out CSP) is an embedded chip packaging technology that eliminates the need for wirebonds and flip-chip bumps. In this study, the board-level reliability of fan-out CSP is studied by using three-dimensional finite element analysis. A design of simulations study is applied to investigate the influences of package geometry on the board-level interconnect reliability...
The problem of a corner delamination in a fan-out chip scale package subjected to thermomechanical load is investigated. The fracture mechanics parameters, including the stress intensity factors, the strain energy release rate, and phase angles, for a quarter-circular corner delamination between silicon die and fan-out redistribution polyimide layer are obtained by using numerical finite element approach...
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