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Nanoelectromechanical (NEM) switches are a candidate to replace solid-state transistors due to their low power consumption. However, the reliability of the contact interface limits the commercialization of NEM switches, since for practical purposes, the electrical contact should be able to physically open and close up to a quadrillion (1015) times without failing due to adhesion (by sticking shut)...
MEMS switch reliability studies have identified contamination of the electrical contact surfaces as an important source of failure. It has been previously reported that the formation of electrically insulating organic deposits degrades switch performance by increasing contact resistance. Previously, we performed a high temperature bakeout under ultra-high vacuum (UHV) to desorb possible contaminant...
The deficiency of existing electrical contact materials is currently a significant impediment to the commercialization of nanoelectromechanical (NEM) contact switches?a low-power ?beyond complementary metal-oxide semiconductor (CMOS) technology? [1]. NEM switches using traditional metallic electrical contact materials, even those composed of inert, noble metals such as gold (Au) and platinum (Pt),...
The deficiency of existing electrical contact materials is currently a significant impediment to the commercialization of nanoelectromechanical (NEM) contact switches - a low power “beyond CMOS technology”. NEM switches utilizing traditional metallic electrical contact materials, even those composed of inert, noble metals such as Au and Pt, demonstrate premature failure due either to their adhesiveness,...
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