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This paper proposes a terahertz(THz) circularly polarized quasi-diagonal horn antenna, which is composed of several etched silicon layers. Through adding the antipodal transition structure, we can obtain good circular polarization performance. The simulated result reveals that the bandwidth for axial ratio below 2dB from 490 GHz to 500 GHz. The return loss below −23dB from 490GHz to 500GHz. Good symmetric...
Reliability of Superjunction (SJ) MOSFET is closely related to its manufacturing process. Experiments are carried out to investigate the electrical characteristics in high temperature of SJ MOSFET produced by deep trench filling technology. Filling holes are confirmed to be responsible for the performance deterioration in high temperature and the mechanism has been analyzed thoroughly.
Mutation Based Fault Localization(MBFL) is a fault localization technique based on mutation analysis, which precisely identifies the location of fault but incurs a high execution cost, since it needs to execute the test suite on a large amount of mutants. Reduction strategies proposed are usually regarding selecting mutation operators or sampling mutants directly, meanwhile at the cost of losing precision...
A terahertz(THz) diagonal multi-layer horn antenna is proposed. The proposed antenna is composed of several silicon layers, monolithically fabricated by dry etching, and sputtering gold and gold-gold thermo-compression bonding. The input return loss shows a level below −8dB from 480 to 500GHz. The gaussicity of radiation patterns at the working band is calculated to be 92%. The proposed antenna exhibits...
The characterization on coupling effect of on-chip octagon spiral inductors has been presented. The coupling effects in different parted distances are presented. And the relationship between the coupling and the distance is plotted and discussed. What's more, a practical design tip about the distance of adjacent inductors is presented. Finally, the predominant role of coupling effect is investigated...
A THz antipodal hyperbolic-sine tapered slot antenna (AHSTSA) designed on silicon is proposed in this paper. The antenna is feed by WR2.2 waveguide and work at 480GHz to 500GHz. The antipodal curved slots and feeding waveguide are designed to be monolithically fabricated by deep reactive-ion etching (DRIE), then sputtering gold, with gold-gold thermo-compression bonding at last. The simulation result...
Opportunistic Routing (OR) has recently been proposed to improve the efficiency of unicast in multi-hop wireless networks. OR exploits the broadcast nature of wireless transmission medium and opportunistically selects a relay path to deliver a packet to its receiver. In this paper, we explore the gain of adopting OR in wireless multicast. The main challenge is to efficiently share opportunistic relay...
The power system in package (SIP) includes multiple chips such as power IGBT, diodes and IC controllers. With more chips encapsulated in one single package, the silicon die crack failure is becoming more and more challenging. In this paper, a leadframe based power SIP package is investigated. The warpage induced reliability in assembly process is studied. The initial leadframe pad warpage will induce...
This paper proposes a design for low profile, compact, circularly polarized double-layer horn antenna integrated with the planar corrugated polarizer with high gain and low cross polarization for THz applications. In particular, the novel polarizer with the planar corrugates is introduced to make the horn antenna circularly polarized. Based on such corrugates, the antenna gained better performance...
The power system in package (SIP) includes multiple chips such as power IGBT, diodes and IC controllers. With more chips encapsulated in one single package, the silicon die crack failure is becoming more and more challenging. In this paper, a leadframe based power SIP package is investigated. The warpage induced reliability in assembly process is studied. The initial leadframe pad warpage will induce...
A novel 0.5THz integrated antipodal curvilinearly tapered slot antenna(ACTSA) with circular polarization is introduced in this paper. The proposed antenna is fed by traditional waveguide and circular polarization is achieved by antipodal curvilinearly tapered slot structure. The antenna structure is well suitable designed by Micro-electromechanical systems (MEMS) technology. The proposed antenna is...
This paper proposed a low-profile terahertz (THz) horn antenna with double-layer corrugated V groove for gain enhancement based on Si-based MEMS technology. The proposed antenna possess bandwidth for VSWR below 1.6 from 275GHz to 750GHz. The double-layer corrugated V groove can be effectively used to improve the gain and side-lobe of antenna from calculation and optimization by using three-dimension...
The board level performance of both thermal cycling test and drop test is investigated to ensure good design and robust manufacturing of the WLCSP. The solder joint fatigue life is usually assumed as the judging criterion for the boardlevel thermal cycling performance of WLCSPs. For the board-level drop test, the solder joints usually fail due to the dynamic impact stress with high strain rate. The...
Substrate noise coupling induced by Through Silicon Vias in SOI substrates is modeled and analyzed in frequency- and time-domain. In addition to a buried oxide layer, a highly doped N+ epi layer used for deep trench devices is taken into account in full-wave electromagnetic simulations. Equivalent circuit models are extracted to assess the impact of noise coupling on active circuit performance. A...
Heavy Al wire wedge bonding is a dominant technique for power packages with high voltage. The parameters that impact the wedge bonding quality are mainly bonding process related and material related. Possible failure modes for wire bonding are non-stick of bond wire to the pad, die surface cratering or peeling of pad metallization, and wire break. In this paper, the dielectric damage under the top...
We demonstrate a Terabit/s receiver by monolithic integration of a polarization independent DWDM echelle grating and high-speed Ge photodiodes on the SOI platform. The compact device has an overall fiber-accessed responsivity of 0.4 A/W.
We demonstrate the integration of low dark current Ge photodetectors with a high performance demultiplexer on a large cross-section SOI waveguide platform. This Si-based WDM receiver can be used for multichannel terabit data transmission.
The operation conditions have been improved via developing new technologies and improving the hardware on HL-2A tokamak in recent years. The ECRH system has been upgraded to 3 MW/68 GHz, the supersonic molecular beam injection (SMBI) fuelling technique has been developed further, and clusters can be formed in the SMB by cooling the gas to around liquid nitrogen temperature, so that deeper penetration...
Power electronic packaging is one of the fastest changing areas of technology in the power electronic industry due to the rapid advances in power integrated circuit (IC) fabrication and the demands of a growing market in almost all areas of power electronic application such as portable electronics, consumer electronics, home electronics, computing electronics, automotive, railway and high/strong power...
In this paper, a comprehensive modeling is carried out to investigate the dynamic behaviors of WL-CSP subjected to both flat and vertical drop impacts. The non-linear dynamic properties include solder, Cu pad and the metal stacking under the UBM. Both of the JEDEC standard flat drop test and the vertical drop test modeling for different solder bump height are studied. The results showed that, in the...
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