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Heat pipes and vapor chamber heat spreaders offer a potential solution to the increasing thermal management challenges in thin-form-factor mobile computing platforms, where efficient spreading is required to simultaneously prevent overheating of internal components and formation of hot regions on the device exterior surfaces. Heat pipe performance limitations unique to such ultrathin form factors...
Improved-efficiency heat spreaders must address ergonomic- and performance-driven thermal management demands of electronic devices of increasingly thin form factor. Heat pipes offer a potential high-conductance solution, but performance limitations unique to sub-millimeter thickness devices must be characterized. Using a reduced-order, one-dimensional resistance network and a two-dimensional numerical...
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